• Raykem Technical Team
  • 2026-05-17
  • Epoxy Systems

Reactive Diluents in Epoxy Systems — Types, EEW and Formulation Guide

Reactive diluents (RDs) are low-viscosity epoxide-functional compounds added to epoxy resin systems to reduce application viscosity without using volatile solvents. Unlike inert diluents or solvents, reactive diluents contain one or more epoxide groups that participate in the cure reaction, becoming chemically bound into the crosslinked network. This guide covers the main reactive diluent types, their epoxy equivalent weight (EEW), effect on cured film properties, and how to calculate the correct hardener stoichiometry when using them.

Why Use Reactive Diluents?

The primary reasons for incorporating reactive diluents into an epoxy system are:

  • Viscosity reduction — Standard bisphenol A epoxy resin (YR-128/828) has viscosity of 11,000–14,000 mPas at 25°C. Even at 10 phr loading, C12-C14 glycidyl ether (RD12) reduces this to 4,000–6,000 mPas, enabling spray or brush application without solvent addition
  • Solvent-free systems — Replacing volatile solvents in floor coatings and industrial maintenance systems to reduce VOC emissions
  • Pot life extension — Some monofunctional diluents slightly extend pot life by diluting reactive epoxide concentration
  • Flexibility improvement — Long-chain aliphatic glycidyl ethers add chain length between crosslinks, improving impact resistance and flexibility

Reactive Diluent Types — Comparison

DiluentCASFunctionalityEEW (g/eq)Viscosity (mPas, 25°C)Effect on Tg
RD12 — C12-C14 AGE68609-97-2Monofunctional285–3105–12Moderate reduction
RD8 — C8-C10 AGE68609-97-2Monofunctional205–2402–5Greater reduction
BGE — Butyl glycidyl ether2426-08-6Monofunctional130–1452–4Significant reduction
BDGE — Butanediol DGE2425-79-8Difunctional110–13015–25Maintains crosslink density
CHDM DGE14228-73-0Difunctional145–16550–100Minimal — maintains Tg
Benzyl alcohol100-51-6Non-reactive (OH)N/A5–6Significant — acts as plasticiser

EEW and Stoichiometry — Calculation When Using RD

When a reactive diluent is added to an epoxy resin, the effective EEW of the blend changes. The hardener quantity must be calculated based on the blend EEW, not the resin EEW alone. Incorrect stoichiometry leads to either under-cured (soft, tacky) or over-cured (brittle) films.

Blend EEW Formula

Blend EEW = 100 / [(% resin / EEW resin) + (% diluent / EEW diluent)]

Example: 90 parts YR-128 (EEW 185) + 10 parts RD12 (EEW 295)
Blend EEW = 100 / [(90/185) + (10/295)] = 100 / [0.4865 + 0.0339] = 192 g/eq
Use 192 as EEW when calculating polyamide or amine hardener PHR.

Effect on Film Properties

RD TypeLoading (phr)Viscosity reductionTg changeFlexibilityRecommended use
RD12 (C12-C14 AGE)5–1030–50%-5 to -10°CImprovedFloor coatings, industrial maintenance
RD1210–2050–70%-10 to -20°CGood flexibilityAdhesives, flexible coatings
BGE5–1040–60%-15 to -25°CModerateOnly where flexibility matters more than Tg
BDGE (difunctional)5–1520–40%MinimalNo loss of hardnessWhen Tg and hardness must be maintained

Skin Sensitisation — Critical Handling Note

All C8–C14 alkyl glycidyl ethers are classified as skin sensitisers (H317) under GHS/CLP. First exposure rarely causes reactions, but repeated skin contact without PPE can lead to occupational contact dermatitis and permanent sensitisation. Once sensitised, even trace exposure causes reactions.

  • Always wear nitrile gloves (≥0.1mm) when handling RD12 or BGE
  • Safety glasses or goggles for splash protection
  • Ensure good ventilation — low vapour pressure but enclosed spaces accumulate vapour at elevated temperatures
  • Wash skin immediately with soap and water if contact occurs — do not use solvents to clean skin

Source Reactive Diluent from Raykem

RAYCURE RD12 — C12-C14 alkyl glycidyl ether. EEW 285–310. Stocked in Dubai. UAE and Saudi Arabia supply. SDS and CoA included.

View RD12 Product → Request a Quote

Frequently Asked Questions

Reactive diluents contain epoxide groups that react into the cured network — they do not evaporate and do not reduce film thickness. Solvents evaporate during and after application, leaving voids and causing film shrinkage. Reactive diluents enable genuinely solvent-free, low-VOC systems.

Typical loading is 5–20 phr (parts per hundred resin). Above 20 phr, Tg reduction becomes significant and film hardness drops noticeably. For floor coatings requiring hardness, stay below 10 phr. For flexible adhesives, up to 20 phr is acceptable. Always recalculate hardener quantity based on blend EEW.

Yes — always recalculate. RD12 has a different EEW from the base resin, so the blend EEW changes. Use the formula: Blend EEW = 100 / [(% resin/EEW resin) + (% diluent/EEW diluent)]. Calculate hardener PHR from blend EEW, not resin EEW alone. Incorrect stoichiometry causes soft or brittle cure.

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